Commercial Applications for Digital Printing Technologies on PCBs
Ron Zohar
April 1, 2004
Applying Digital Printing in the PCB Industry
Advertisement
|
|
Traditional printing on PCBs includes screen-printing
and photoimaging. These printing technologies involve high production
costs, time-consuming procedures and several production steps. In
today’s competitive PCB industry, where production runs are getting
shorter, it is needless to say that cutting production costs and making
procedures more efficient are import for the PCB manufacturer to remain
competitive. PCB manufacturers therefore willingly accept this new
technology to the PCB industry, and are quickly shifting from
conventional to digital printing.
Applications for Digital Printing
Printing technologies are involved in numerous PCB manufacturing
steps, and digital printing is applicable for many of them. A few
companies today are active in the area of digital legend printing,
usually by adapting laser plotters or electrical testers and modifying
them for legend printing. It is not surprising that these companies
offer printing systems for legend printing, since this forms the easiest
digital printing application for PCB manufacturing.
Legend printing involves only approximately 2-3% of the total PCB
manufacturing costs, while other applications, such as soldermask
printing, accounts for up to 10-15% of the total PCB manufacturing
costs. The use of digital printing is important for all production
steps, however, its application will be most significant for the
expensive process steps.
So, while the actual introduction of digital printing to the PCB
industry is important, mainly to change its work processes, it is
necessary to analyze the printing technologies offered in context to
other more demanding applications such as soldermask printing. This is
the real challenge for digital PCB printing technologies. The next
chapter deals in-depth with the challenges PCB printer suppliers face to
provide the best possible solutions to the industry, and discusses
problems such as inkjet print-head reliability, PCB attachment,
contamination and ink types, and describes possible solutions to the
different problems.
Major Technological Issues in PCB Inkjet Printing:
1. Satellites and Tails
|
Figure 1. Schematic drawing of a print head chamber, showing a tail breaking down and forming a satellite (left to right). |
|
|
Satellites and tails (or ligaments) are a major issue in
the design of high quality ink jet systems, and pose special
requirements both to ink developers and the printing system designers.
Satellites. When the ink droplet is ejected out of the nozzle, a
tail is formed. This tail may break into small fragments, which tend to
form yet smaller droplets. These smaller droplets follow the main drop,
hence the term “satellites.” The satellites, having lower mass and
momentum, tend to have lower velocities and hit the PCB surface in
different random locations. The development of suitable ink for PCB
inkjet printing will solve this problem.
Tails. If the relative speed between the PCB and the print head
is too high, the tails will be evident on the PCB, even when it does not
break into satellites. The speed of a PCB inkjet system has to be very
carefully chosen to avoid this problem. Using multiple print heads for
printing will comply with the requirements for high throughput of the
PCB manufacturers, without having to use high relative velocities, which
result in the tails showing on the PCB.
2. Reliability of a Moving Ink-Jet Print Head
|
Figure 2. Positive pressure
causes a drop to form and drop down at a random location on the PCB,
potentially causing a fatal defect. |
|
|
Ink-jet printing is based on a delicate balance between
very small negative pressures vs. the meniscus formed inside the nozzle
(Figures 2-3). The pressure required is approximately 0.001 ATM, with a
tolerance of 0.0001 ATM. A mechanical impulse is activated on the ink in
the firing chamber to eject a single droplet, and then the meniscus is
almost instantaneously formed again.
|
Photo 1. Printing by a single
head machine. The head moves too fast, causing the tails (or ligaments)
to hit the SMT pads, creating fatal defects. This picture also shows
multiple satellites on the PCB surface. |
|
|
The acceleration (and de-acceleration) of a moving
ink-jet print head creates a positive or negative pressure variance,
depending on acceleration direction. This pressure difference is
calculated as the acceleration times the dimension of the body of liquid
in the acceleration direction. Since the tolerance window for pressure
is very tight, two possible effects might occur, depending on
acceleration direction. Both effects might cause fatal defects.
|
Figure 3. Negative pressure
causes air ingestion, resulting in inconsistent drop shooting which may
lead to drop placement error, potentially causing a fatal defect. |
|
|
First, positive pressure will cause unintentional
leaking of ink from the nozzle, which might hit the PCB at random,
including at SMT and BGA pads.
Negative pressure will cause air ingestion (intake) through the nozzle,
and will form an air bubble inside the ink-jet firing chamber. In the
better case this can cause a sporadic and temporary firing problem,
manifesting itself in a “missing nozzle.” In the worst case, the nozzle
will fire the drops sideways, causing potentially fatal defects.
|
Photo 2. Stationary print heads ensure immunity from temporary nozzle failure caused by accelerations. |
|
|
To eliminate pressure variation problems in ink-jet
print heads all together, PCB inkjet printers should be designed with
stationary print heads, where the PCB has to perform all the X-Y
motions. Ink heads should only perform slow movements in the Z-direction
to compensate for various PCB thicknesses. The trade-off for stationary
heads is the relatively bigger size of the systems. However, a bigger
footprint of the printer is the better choice and less expensive than
the costs of fatal defects on PCBs.
3. PCB Attachment and Flattening
|
Figure 4. |
|
|
An ink-jet PCB print head must keep a constant distance
from the PCB, maintaining a tolerance of approximately ±0.2 mm to avoid
gradual printing quality degradation that can lead to fatal PCB defects.
If the distance between the print head and the PCB is too big, the small
inkjet droplet will lose momentum due to air friction and start
wandering around, much like an aerosol droplet. It might eventually be
dropped on an SMT or a BGA pad and destroy a $1,000 populated PCB. To
get the feeling of it, try to visualize throwing a feather. When it
leaves your hand the feather still has some velocity and momentum, but
soon enough it will begin floating in the air, landing at random.
If the distance is too small, one of two things might happen. In the
extreme case when the print head hits the PCB, it will smear the fresh
printing, destroy the print head, and scratch the PCB. If the head is
very close, but not touching the PCB yet, high velocity droplets
impacting the PCB surface may be splashed on the PCB.
Legend or soldermask printing is performed on the outerlayers of the
PCB. By then the PCB is nearly finished, and is typically quite rigid
and in many cases far from being perfectly flat. In addition, even the
PCB thickness itself may vary to some extent. All that has been
mentioned clearly indicates that adequate PCB attachment and flattening
is a major, critical requirement for keeping the necessary constant
distance between the PCB and the print head.
Using mechanical clamps that hold the PCB edges down can solve PCB edge
deformation. Commonly, a vacuum table should solve the problem of bows
occurring in the center of a PCB, however, pressure is lost through the
PCB holes. In addition, the air that passes through the holes deflects
the ink-jet droplets and might cause fatal defects.
The combination of vacuum table and clamps forms one possible solution
for PCB attachment, provided that the printing system delivers the
appropriate solution for the drop deflection problem. Air flow spoilers
are one possible solution: whenever there is a free flow path through a
PCB hole which overlaps with a vacuum table hole, the increased flow
will meet an obstacle creating increased turbulence. This turbulence
will significantly decrease the flow. Another, far better solution, is
to design a table where the vacuum is enabled only at locations not
being currently printed.
4. Print Head Contamination
|
Figure 5. |
|
|
In industrial PCB manufacturing plants—especially in the
legend printing room—there is typically some level of contamination,
particularly dust particles and fibers. Since inkjet printing requires a
distance of about 1-1.5 mm between the print head and the PCB, any dust
particle, hair, or a paper fiber that somehow gets attached to the
print head will cause smearing of the just-printed ink on the PCB,
causing potentially fatal defects.
The print-head is always covered with a thin liquid layer which readily
absorbs any such particle. Therefore, the system designer must enable
the system to be configured, optionally, to deal with the problem. A
solution may include a filter that creates inside the machine a positive
pressure of clean air, an external filtered air cover and, to make sure
that the PCB itself does not introduce contamination into the machine,
an air knife and electrostatic discharge rode to clean the panel.
5. Finding Suitable Ink for PCB Legend Printing
Choosing the suitable inkjet ink is always closely tied to the
nature of the substrate. The PCB is a non-absorbing substrate, which
creates a fixation problem for the ink drop after it is ejected from the
print head and hits the substrate.
Using UV curable ink is the most straightforward solution for PCB
printing. However, inkjet UV inks have three inherent problems: poor
adhesion; low pigment density, and toxicity.
This solution can cause potential health problems. Inkjet UV ink, not
like non-inkjet UV ink, must have very low viscosity (around 10 CPS) to
be inkjet compatible (“jetable”). To reach this low viscosity, inkjet UV
ink contains a high percentage of reactive monomers, which are small
polymer molecules having low molecular weight. However, this attribute
enables the monomers to be easily absorbed through the human skin and
lungs into the blood stream, where it activates the immune system and
responds by creating antibodies. The level of sensitivity is individual.
It might gradually increase over the course of months or even years,
until this person reaches a state of high sensitivity. The person is
then “sensitized.” This fact is irreversible, and the injured person
must be banned from exposure to such materials. In some cases this means
forced early retirement and increased severance payments. Sometimes the
reaction to monomers is almost immediate. On the other hand, there are
people who show little or no sensitivity at all.
|
Photo 3. An example of adhesion problem in UV ink. |
|
|
Poor adhesion is caused by two factors. First, UV ink
shrinks during curing, which creates a gradual shift and dislocation at
the interface with the substrate. Second, pigment scatters the UV
radiation, especially in white UV inks. The interface between the ink
drop and the substrate is covered by the bulk of the whole drop, which
reflects UV radiation, and therefore curing at the interface is
relatively poor.
Low pigment density is a necessary fact for inkjet UV printing on PCBs.
High pigment loading would prevent the UV light propagation in the bulk
of the ink drop, and would disable the curing process.
The development of heat-curable ink-jet for PCB legend is a much more
complex task. The most challenging task is causing the ink to stop its
flow. However, the use of heat-curable ink would solve all the
above-mentioned problems that exist for UV-curable inks. Heat-curable
ink is not toxic and enables high pigment loading. It has excellent
adhesion, since no shrinkage occurs; curing is based on heat, and heat
propagates easily to the PCB-ink interface.
A practical heat-curable PCB legend ink solution is as follows: the flow
of the ink is restricted by controlling its rheological properties, and
by drying the ink immediately after printing.
Considerations for Soldermask Inkjet Printers
Once the industry adopts soldermask inkjet printing, very strict
requirements will dictate the engineering design of printing systems.
Adaptation of plotters or electrical testers will not be able meet these
requirements, and application-specific printing systems need to be
developed. Below is a list of soldermask-specific requirements and
possible inkjet printer solutions.
Quality and reliability. Reliability and printing quality
requirements for soldermask inkjet printing are much stricter, and
dictate the use of stationary print heads. In soldermask printing, most
of the panel, except the pads, has to be coated. Even a small
“pin-hole,” exposing two adjacent conductors, can cause a critical
defect, such as during wave soldering. Side firing of the ink, when
printing very close to the pads, such as solder dams in fine pitch SMT
or BGA pads, will cause a fatal defect.
The combination of higher speed and higher resolution. The IPC
soldermask roadmap specifies solder dams of 50 microns; this dictates
the use of high-resolution print heads. Throughput requirements of the
industry are commonly 120-150 sides per hour. These combined
requirements on one hand, and the relative speed limitation imposed by
the ligament problem for inkjet print heads on the other hand, strongly
suggest the use of multiple print head printers. Printers with
stationary big printing bridge are easily scalable to any required
number of print heads.
Material quantity. Soldermask printing requires large amounts of
material: 50 to 100 kilograms per day. This strongly suggests the use of
a stationary printing bridge and a stationary ink supply system that
complies to the requirement for a very high ink flow rate.
Material considerations. Soldermask, as a critical element in the
final construction of the PCB, prevents shorts between adjacent SMT and
BGA pads, and protects the circuit from any environmental influences.
Materials comparable in performance to currently used soldermask
materials are necessary to meet these requirements and dictate the use
of heat curable epoxy based materials.
The design and qualification of a heat-curable inkjet soldermask
requires major R&D focus and investment, due to a set of challenging
requirements.
Other Major Considerations in PCB Inkjet Printing
There are many other aspects in PCB inkjet printing system and ink
design—most notably regarding reliability and print quality. Much
proprietary technology is employed under the surface without the
customer being necessarily aware. Some of the obvious aspects in the
design of high reliability inkjet systems include print head capping,
wiping, and exercising facilities, ink circulation, etc. Inkjet and
digital printing pioneers in the Graphic Arts industry have been laying
the foundations for the current state of industrial inkjet technology.
The fact that the PCB industry is now embracing digital printing is
actually an old and established technology migration path. (It is no
coincidence that the PCB manufacturing process is so similar to the
process of manufacturing the offset printing plate).
But as always, there is work to be done when adopting a new printing
technology from the traditional graphics arts to the PCB industry, which
has its own special requirement. Speaking on behalf of PCB inkjet
printers designers, I believe we can say, quoting Sir Isaac Newton, “We
could see so far ahead, only because we stood on the shoulders of
giants.”